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product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 tsz22111 ? 14 ? 001 www.rohm.com 4.5v to 13.2v, 2a 1ch synchronous buck converter with integrated fet BD9141MUV general description the BD9141MUV is rohms high efficiency step-down switching regulator designed to produce a low voltage including 5.0v/3.3v from 2 lithium cell power supply line. it offers high efficiency by using pulse skip control technology and synchronous switches, and provides fast transient response to sudden load changes by implementing current mode control. features fast transient response because of current mode pwm control system high efficiency for all load ranges because of synchronous rectifier (nch/pch fet) and sllm tm (simple light load mode) soft-start function thermal shutdown and uvlo functions short-circuit protection with time delay function shutdown function key specifications ? input voltage range: 4.5v to 13.2v ? output voltage range: 2.5v to 6.0v ? output current: 2.0a(max) ? switching frequency: 500khz(typ) ? pch fet on-resistance: 150m ? (typ) ? nch fet on-resistance: 80m ? (typ) ? standby current: 0 a (typ) ? operating temperature ra nge: -40c to +105c package w(typ) x d(typ) x h(max) applications power supply for lsi including dsp, microcomputer and asic typical application circuit figure 1. typical application circuit v qfn020v4040 4.00mm x 4.00mm x 1.00mm gnd,pgnd sw vcc,pvcc en a dj ith v cc c in r ith c ith l c o r2 v out r1 datashee t downloaded from: http:///
2/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV pin configuration figure 2. pin configuration pin description pin no. pin name pin function 1,2,3,4,5 sw power switch node 6,7,8 pvcc power switch supply pin 9 n.c. no connection 10 vcc power supply input pin 11 gnd ground pin 12 adj output voltage detection pin 13 ith gmamp output pin/connected to phase compensation capacitor 14 vreg reference voltage 15,16 n.c. no connection 17 en enable pin(active high) 18,19,20 pgnd power switch ground pin block diagram figure 3. block diagram sw o p q r s t u v w o n p n o w o v o u o t o s o r o q o p o o n.c. n.c. pgnd en pvcc vcc gnd adj ith vreg n.c. (top view) vcc pvcc v cc v cc r 1 r 2 r ith c ith downloaded from: http:///
3/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV absolute maximum ratings parameter symbol limit unit vcc voltage v cc -0.3 to +15 (note 1) v pvcc voltage pv cc -0.3 to +15 (note 1) v en voltage v en -0.3 to +15 v sw voltage v sw -0.3 to +15 v ith,vreg, adj voltage v ith , v reg v adj -0.3 to +7 v power dissipation 1 pd1 0.34 (note 2) w power dissipation 2 pd2 0.70 (note 3) w power dissipation 3 pd3 2.21 (note 4) w power dissipation 4 pd4 3.56 (note 5) w operating temperature range topr -40 to +105 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax +150 c (note 1) pd should not be exceeded. (note 2) ic only. (note 3) mounted on a 1 layer board 74.2mmx74.2m mx1.6mm glass-epoxy pcb (copper foil area : 10.29mm 2 ) (note 4) mounted on a 4 layer board 74 .2mmx74.2mmx1.6mm glass-epoxy pcb (1 st , 4th copper foil area : 10.29mm 2 2 nd ,3 rd copper foil area : 5505mm 2 ),. (note 5) mounted on a 4 layer board 74.2mmx74.2m mx1.6mm glass-epoxy pcb (copper foil area : 5505mm 2 ) , copper foil in each layers. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-40c to +105c) parameter symbol limit unit min typ max vcc voltage v cc (note 6) 4.5 (note 7) 8.0 13.2 v pvcc voltage pv cc (note 6) 4.5 (note 7) 8.0 13.2 v en voltage v en 0 - v cc v sw average output current i sw (note 6) - - 2.0 a output voltage setting range v out (note 7) 2.5 - 6.0 v (note 6) pd should not be exceeded. (note 7) v ccmin = v out + 1.3v. electrical characteristics (ta=25c, v cc =pv cc =8.0v, v en =v cc , r 1 =8.2k ? , r 2 =43k ? , unless otherwise specified.) parameter symbol limit unit conditions min typ max standby current i stb - 0 10 a en=gnd bias current i cc - 300 500 a en low voltage v enl - gnd 0.8 v standby mode en high voltage v enh 2.0 v cc - v active mode en input current i en - 1.6 10 a v en =8v oscillation frequency f osc 400 500 600 khz pch fet on-resistance r onp - 150 300 m ? pv cc =8v nch fet on-resistance r onn - 80 160 m ? pv cc =8v adj voltage v adj 0.788 0.800 0.812 v ith sink current i thsi 10 20 - a v adj =1.0v ith source current i thso 10 20 - a v adj =0.6v uvlo threshold voltage v uvlo1 3.90 4.10 4.30 v v cc =8v to 0v uvlo release voltage v uvlo2 3.95 4.20 4.50 v v cc =0v to 8v soft-start time t ss 0.5 1 2 ms timer latch time t latch 1 2 3 ms scp/tsd operated output short-circuit threshold voltage v scp - 0.4 0.56 v v adj =0.8v to 0v downloaded from: http:///
4/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV typical performance curves figure 6.output voltage vs output current output voltage: v out [v] output current: i out [a] v out =5v v cc =8v ta=25c figure 7. output voltage vs temperature output voltage: v out [v] temperature: ta [c] v out =5v v cc =8v i o =0a figure 4. output voltage vs input voltage output voltage: v out [v] input voltage: v cc [v] v out =5v ta=25c i o =2a figure 5. output voltage vs en voltage en voltage: v en [v] output voltage: v out [v] v out =5v v cc =8v ta=25c i o =0a downloaded from: http:///
5/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV typical performance curves - continued figure 8. efficiency vs output current efficiency: [%] output current: i out [ma] v out =5v v cc =8v ta=25c figure 9. frequency vs temperature temperature: ta [c] frequency: f osc [khz] v cc =8v figure 10. on-resistance vs temperature temperature: ta [c] on-resistance: r on [ ? ] v cc =8v figure 11.on-resistance vs temperature temperature: ta [c] on-resistance: r on [ ? ] v cc =8v downloaded from: http:///
6/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV typical performance curves C continued typical waveforms figure 13. frequency vs input voltage input voltage: v cc [v] frequency: f osc [khz] figure 14. soft start waveform v cc =8v figure 15. sw waveform (i o =10ma) v cc =8v v out =5v figure 12. circuit current vs temperature circuit current: i cc [a] temperature: ta [c] v cc =8v ta=25c i o =0a v out v cc =pv cc =en ta=25c i o =0a v out sw downloaded from: http:///
7/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV typical waveforms C continued figure 16. sw waveform (i o =2000ma) figure 17. transient response (i o =0.5a to 1a, 10 s) v cc =8v v cc =8v v out v out i out [v out =5v] figure 18. transient response (i o =1a to 0.5a, 10 s) v cc =8v v out i out v out =5v] downloaded from: http:///
8/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV application information 1. operation BD9141MUV is a synchronous step-down switching regulator that achieves fast transient response by employing current mode pwm control system. it utilizes swit ching operation either in pwm (pulse wi dth modulation) mode for heavier load, or sllm tm (simple light load mode) operation for lighter load to improve efficiency. (1) synchronous rectifier integrated synchronous rectif ication using two mosfets reduces power dissipation and increases efficiency when compared to converters using external diodes. internal shoot-through current limiting ci rcuit further reduces power dissipation. (2) current mode pwm control the pwm control signal of this ic depends on two feedback loops, the voltage feedback and the inductor current feedback. (a) pwm (pulse width modulation) control the clock signal coming from osc has a frequency of 500k hz. when osc sets the rs latch, the p-channel mosfet is turned on and the n-channel mosfet is turned off. the opposite happens when the current comparator (current comp) resets the rs latch i.e. the p-channel mosfet is turned off and the n-channel mosfet is turned on. current comps output is a comparis on of two signals, the current feedback control signal sense which is a voltage proportional to the current i l , and the voltage feedback control signal, fb. (b) sllm tm (simple light load mode) control when the control mode is shifted by pwm from heavier load to lighter load or vise-versa, the switching pulse is designed to turn off with the device held operating in normal pwm control loop. this allows linear operation without voltage drop or deterioration in transi ent response during the sudden load changes. although the pwm control l oop continues to operate with a set signal from osc and a reset signal from current comp, it is designed such that the reset signal is continuously sent even if the load is changed to light mode where the switching is tuned off and the switching pulses disappear. activating the switching discontinuously reduces the switching dissipation and improves the efficiency. figure 19. diagram of current mode pwm control fi gure 20 . pwm s w i tc hi ng t i m i ng di agram figure 21. sllm tm switching timing diagram curren t comp set reset sw v out pv cc gnd gnd gnd i l (ave) v out (ave) sense fb i l curren t comp set reset sw v out pv cc gnd gnd gnd 0a v out (ave) sense fb i l not switching osc level shift driver logic rqs i l sw r ith current comp gm amp set reset fb load sense v out v out downloaded from: http:///
9/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV 2. description of functions (1) soft-start function during start-up, the soft-start gradually establishes the output voltage to limit the inpu t current. this prevents the overshoot in the output voltage and inrush current. (2) shutdown function when en terminal is low, the device operates in standby mode, and all the functional blocks including reference voltage circuit, internal oscillator and drivers are tu rned to off. circuit current during standby is 0 a (typ). (3) uvlo function it detects whether the supplied input voltag e is sufficient to obtain the output volt age of this ic. a hysteresis width of 100mv (typ) is provided to prevent the output from chattering. figure 22. soft-start, shutdown, uvlo timing chart (4) short-circuit protection with time delay function to protect the ic from breakdown, the short-circuit protection turns the output off when t he internal current limiter is activated continuously for a fixed time(t latch ) or more. the output that is kept off may be turned on again by restarting en or by resetting uvlo. figure 23. short-circuit protection with time delay diagram hysteresis 100mv t ss t ss t ss soft start standby mode operating mode standby mode operating mode standby mode operating mode standby mode uvlo en uvlo uvlo v cc en v ou t t2=t latch output off latch en v out output short circuit threshold voltage i l standby mode operating mode operating mode en timer latch en standby mode i l limi t t1 10/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV 3. information on advantages advantage 1 it offers fast transient response by using current mode control system. voltage drop due to sudden change in load was reduced. figure 24. comparison of transient response advantage 2 it offers high efficiency for all load ranges (a) for lighter load: this ic utilizes the current mode control mode called sllm tm , which reduces various dissi pation such as switching dissipation (p sw ), gate charge/discharge dissipation (p gate ), esr dissipation of output capacitor (p esr ) and on-resistance dissipation (p ron ) that may otherwise cause reduction in efficiency. it achieves efficiency improvement for lighter load. (b) for heavier load: this ic utilizes the synchronous re ctifying mode and uses low on-resistance mosfets incorporated as power transistor. on-resistance of p-channel mosfet : 150m ? (typ) on-resistance of n-channel mosfet : 80m ? (typ) it achieves efficiency improvement for heavier load. it offers high efficiency for all load ranges with the improvements mentioned above. advantage 3 ? it is supplied in smaller package due to small-sized power mosfet. reduces mounting area requirement. fi gure 2 5. effi c i ency conventional product (load response i o =0.5a to 1a) BD9141MUV (load response i o =0.5a to 1a) ? output capacitor c o required for current mode control: 22f ceramic capacitor ? inductance l required for the operating frequency of 500khz: 4.7h inductor v out i out v out i out 50mv 110mv dc/dc convertor controller r ith l c o v out c ith v cc c in 10mm 15mm r ith c ith c in c o l fi gure 26 . e xamp l e a pp li cat i on 0.001 0.01 0.1 1 0 50 100 pwm sllm tm improvement by sllm tm system improvement by synchronous rectifier efficiency : [%] output current i out [a] downloaded from: http:///
11/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV 4. switching regulator efficiency the efficiency ? may be expressed by the equation shown below: the efficiency may be improved by reducing the switching regulator power dissipation factors pd as follows: dissipation factors: (1) on-resistance dissipation of inductor and fet pd(i 2 r) where: r coil is the dc resistance of inductor r on is the on-resistance of fet i out is the output current (2) gate charge/di scharge dissipation pd(gate) where: c gs is the gate capacitance of fet f is the switching frequency v is the gate driving voltage of fet (3) switching dissipation pd(sw) where: c rss is the reverse transfer capacitance of fet. i drive is the peak current of gate. (4) esr dissipation of capacitor pd(esr) where: i rms is the ripple current of capacitor. esr is the equivalent series resistance. (5) operating current dissipation of ic pd(ic) where: i cc is the circuit current. cc in i v ic pd ? ? ) ( esr i esr pd rms ? ? 2 ) ( drive out rss in i f i c v sw pd ? ? ? ? 2 ) ( ) ( ) ( 2 2 on coil out r r i ri pd ? ? ? [%] 100 100 100 ? ? ? ? ? ? ? ? ? ? ? pd p p p p i v i v out out in out in in out out 2 ) ( v f c gate pd gs ? ? ? downloaded from: http:///
12/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV 5. consideration on permissible dissipation and heat generation since this ic functions with high efficiency without signi ficant heat generation in mo st applications, no special consideration is needed on permissible dissipat ion or heat generation. in case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/o r higher temperature, the permi ssible dissipation and/or heat generation must be carefully considered. for dissipation, only conduction losses due to dc resistance of inductor and on-resistance of fet are considered. this is because the conduction losses are the most significant among other dissipation m entioned above such as gate charge/discharge dissipation and switching dissipation. if v cc =8v, v out =5v, r onp =0.15 ? , r onn =0.08 ? i out =2a, for example, ?? ?? ?? w p r v v d on cc out 495.0 12375 .0 2 12375 .0 03.0 09375 .0 08.0 625.01 15.0 625.0 625.0 8/5 / 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? since r onp is greater than r onn in this ic, the dissipation increases as the on duty increases. taking into consideration the dissipation shown above, thermal design must be carried out with sufficient margin. figure 27. thermal derating curve (vqfn020v4040) where: d is the on duty (=v out /v cc ). r onp is the on-resistance of p-channel mos fet r onn is the on-resistance of n-channel mos fet. i out is the output current. 4 layers (copper foil area : 5505mm 2 ) copper foil in each layers. j-a=35.1c /w 4 layers (copper foil area : 10.29m 2 ) 2, 3 layers copper foil area : 5505mm 2 ). j-a=56.6c /w 1 layers (copper foil area : 10.29m 2 ) j-a=178.6c /w ic only. j-a=367.6c /w onn onp on on out rd r d r r i p ) 1( 2 ? ? ? ? ? ? 0 25 50 75 100 125 150 0 2.0 3.0 4.0 2.21w 3.56w power dissipation: pd [w] [w] 1.0 4.5 0.70w 0.34w 105 a mbient temperature: ta [c] downloaded from: http:///
13/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV 6. selection of components externally connected (1) selection of inductor (l) note: current exceeding the current rating of an inductor results in magnetic saturation of the inductor, which decreases efficiency. the inductor must be selected with sufficient margin in which the peak current may not exceed its current rating. if v cc =8v, v out =5v, f=500khz, i l =0.3 x 2a=0.6a, for example, (BD9141MUV) note: select an inductor with low resistance component (such as dcr and acr) to minimize dissipation in the inductor for better efficiency. (2) selection of output capacitor (c o ) the inductance significantly depends on the output ripple current. a s seen in equation (1), the ripple current decreases as the inducto r and/or switching frequency increases. [ a ] ??? ( 1 ) a ppropriate output ripple curr ent should be about 30% of the maximum output current. [a] ??? (2) [ h ] ??? ( 3 ) output capacitor should be selected wi th the consideration on the stability region and the equivalent series resistance required to minimize ripple voltage. output ripple voltage is determined by the equation (4) [v] ??? (4) note: rating of the capacitor should be determined allowing sufficient margin against output voltage. a 22 f to 100 f ceramic capacitor is recommended. less esr allows reduction in output ripple voltage. figure 29. output capacitor i l v cc i l l c o v out figure 28. output ripple current i l v cc l c o v out esr where: i l is the output ripple current. f is the switching frequency where: i l is the output ripple current e sr is the equivalent series resistance of output capacitor ? ? f v l v v v i cc out out cc l ? ? ? ? ? ? ? ? f v i v v v l cc l out out cc ? ? ? ? ? ? ?? ?? h k l ? ? 3.6 25.6 500 8 6.0 5 5 8 ? ? ? ? ? ? ? esr i v l out ? ?? ? outmax l i i ? ? ? 3.0 downloaded from: http:///
14/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV (3) selection of input capacitor (c in ) a low esr 22 f/25v ceramic capacitor is recommended to reduce esr dissipation of input capacitor for better efficiency. (4) calculating r ith , c ith for phase compensation since the current mode control is designed to limit inductor current, a pole (phase lag) appears in the low frequency area due to a cr filter consisting of a output capacitor and a load resistance, wh ile a zero (phase lead) appears in the high frequency area due to the output capacitor and it s esr. therefore, the phases are easily compensated by adding a zero to the power amplifier output with c and r as described below to cancel the pole at the power amplifier. the input capacitor must be a low esr capacitor with capacitance sufficient enough to cope with high ripple current to prevent high transient voltage. the ripple current i rms is given by the equation (5): [ a ] ??? ( 5 ) < worst case > i rmsmax figure 31. open loop gain characteristics figure 32. error amp phase compensation characteristics pole at power amplifie r when the output current decr eases, the load resistance ro increases and the pole frequency decreases. zero at power amplifie r figure 30. input capacitor v cc l co v out c in a 00 -90 fz(amp) gain [db] phase [deg] a 00 -90 fp(min) fp(max) fz(esr) i outmin i outmax gain [db] phase [deg] increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (this is because when the capacitance is doubled, the capacitor esr is reduced to half.) if v cc =8v, v out =5v, and i outmax = 2a, (bd9140muv) ?? ith ith amp c r fz ? ? ? ? 2 1 load heavier with hz c r fp o omin max ? ? ? ? ] [ 2 1 ) ( ? ?? load lighter with hz c r fp o omax min ? ? ? ? ] [ 2 1 ? ?? o esr z o o c esr f c r fp ? ? ? ? ? ? ? ? 2 1 2 1 2 i i, v the twice is v when out rms out cc ? ? ? cc out cc out out rms v v v v i i ? ? ? ? ? ] [ 96.0 8 5 85 2 rms rms a i ? ? ? ? downloaded from: http:///
15/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV stable feedback loop may be achieved by canceling the pole fp(min) produced by the output capacitor and the load resistance with cr zero correction by the error amplifier. (5) setting the output voltage the output voltage v out is determined by the equation (6): adj out v r r v ? ? ? )1 / ( 1 2 ??? (6) where: v adj is the voltage at adj terminal (0.8v typ) the required output voltage may be determined by adjusting r 1 and r 2 . adjustable output voltage range: 2.5v to 6.0v figure 34. setting the output voltage use 1 k ? to 100 k ? resistor for r 1 . when using a resistor with resistance higher than 100 k ? , check the assembled set carefully for ripple voltage etc. (6) selection of the reference voltage capacitor (c vreg ) vreg voltage : reference voltage created by input voltage (vcc voltage). c vreg capacitor should be 0.1f or more. gnd,pgnd sw vcc, pvcc en vout ith v cc v out c in r ith c ith l esrc o r o v out figure 33. typical application the minimum input voltage depends on the output voltage. basically, it is recommended to use the condition: v v v out ccmin 3.1 ? ? figure 35 shows the necessary output current value at the minimum input voltage. (dcr of inductor: 0.1 ? ) this data is the characteristic value, so it doesnt guarantee the operation range. o ith ith min amp c romax c r fp fz ? ? ? ? ? ?? ? ? ? ? 2 1 2 1 ) ( ) ( 4.5 5 5.5 6 6.5 7 7.5 8 00 . 5 11 . 52 out put current : iout [a] input voltage : vcc[v] figure 35. minimum input voltage in each output voltage v o =3.3v v o =4.0v v o =5.0v v o =6.0v output current :i out [a] input voltage :v cc [v] sw 6 1 a dj l co r 2 r 1 output downloaded from: http:///
16/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV 7. BD9141MUV cautions on pcb layout figure 36. layout diagram for the sections drawn with heavy line, use thick conductor pattern as short as possible. layout the input ceramic capacitor c in closer to the pins pvcc and pgnd, and the output capacitor c o closer to the pin pgnd. layout c ith and r ith between the pins ith and gnd as near as possible with least necessary wiring. the non connection pin must be left open or connected to gnd. note: vqfn020v4040 (BD9141MUV) has thermal fin on the reverse of the package. the package thermal performance may be enhanced by bonding the fin to gnd plane which occupy a large area of pcb. 8. recommended components lists on above application symbol part value manufacturer series l coil 4.7h tdk rlf7030t-4r7m3r4 c in ceramic capacitor 22f kyocera cm32x5r226m25a c o ceramic capacitor 22f kyocera cm32x5r226m10a c vreg ceramic capacitor 0.1 f murata grm188b31h104ka92 c ith ceramic capacitor v o =3.3v 1000pf murata grm1882c1h102ja01 v o =5v 1000pf murata grm1882c1h102ja01 r ith resistance v o =3.3v 20k ? rohm mcr03 series v o =5v 47k ? rohm mcr03 series note: the parts list presented above is an example of the recommended parts. although the parts are standard, actual circuit characteristics should be checked on your application carefully before use. be sure to allow sufficient margins to accommodate variations between external devices and this ic when employing the depicted circuit with other circuit constants modified. both static and transient characteristics should be consi dered in establishing these margins. w hen switching noise is significant and may a ffect the system, a low pass filter should be inserted between t he vcc and pvcc pins, and a schottky barrier diode established betwee n the sw and pgnd pins. a dj vcc ith gnd en pvcc sw pgnd v cc r ith gnd c o c in v out en l c ith r 2 r 1 vreg c vreg downloaded from: http:///
17/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV i/o equivalent circuit figure 37. i/o equivalent circuits en ? en pin ? sw pin pv cc sw pv cc pv cc ith ? ith pin v cc ? adj pin a dj ? vreg pin vreg v cc v cc downloaded from: http:///
18/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity w hen connecting the power supply, such as mounting an external diode between the power supply and the ics p ower supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply li nes of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of ex ceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guar anteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong elec tromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
19/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. t he small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction op erates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 38. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. 14. selection of inductor it is recommended to use an inductor with a series resistance element (dcr) 0.1 ? or less. especially, note that use of a high dcr inductor will cause an inductor loss, resu lting in decreased output voltage. should this condition continue for a specified period (soft start time + timer latc h time), output short circuit protection will be activated and output will be latched off. when using an inductor over 0.1 ? , be careful to ensure adequate margins for variation between external devices and this ic, including transient as well as static characteristics. furthermore, in any case, it is recommended to start up the output with en after supply voltage is within. downloaded from: http:///
20/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV ordering information b d 9 1 4 1 m u v e 2 part number package muv: vqfn020v4040 packaging and forming specification e2: embossed tape and reel marking diagram vqfn020v4040 (top view) d9141 part number marking lot numbe r 1pin mark downloaded from: http:///
21/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV physical dimension, tape and reel information package name vqfn020v4040 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
22/22 tsz02201-0j3j0aj00180-1-2 ? 2012 rohm co., ltd. all rights reserved. 04.jun.2015 rev.003 www.rohm.com tsz22111 ? 15 ? 001 datasheet d a t a s h e e t BD9141MUV revision history date revision changes 02.mar.2012 001 new release 03.oct.2014 002 applied the rohm standard style and improved understandability. 04.jun.2015 003 updated the contents of japanese datasheet. the english datasheet was updated from ver.002 to 003. downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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